Electroless copper plating solution, electroless copper...

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

Reexamination Certificate

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C106S001260

Reexamination Certificate

active

10898282

ABSTRACT:
An electroless copper plating solution using glyoxylic acid as a reducing agent, which is small in the reacting quantity of Cannizzaro reaction, does not largely cause precipitation of the salt accumulated in the electroless copper plating solution by the plating reaction and Cannizzaro reaction, and can be used stably over a long period of time. The electroless copper plating solution comprises copper ion, a complexing agent for copper ion, a reducing agent for copper ion and a pH adjusting agent, wherein the reducing agent for copper ion is glyoxylic acid or a salt thereof, the pH adjusting agent is potassium hydroxide and the electroless copper plating solution contains at least one member selected from metasilicic acid, metasilicic acid salt, germanium dioxide, germanic acid salt, phosphoric acid, phosphoric acid salt, vanadic acid, vanadic acid salt, stannic acid and stannic acid salt in an amount of 0.0001 mol/L or more.

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patent: 4303443 (1981-12-01), Miyazawa et al.
patent: 4617205 (1986-10-01), Darken
patent: 6645557 (2003-11-01), Joshi
patent: 6660071 (2003-12-01), Yoshida et al.
patent: 6805915 (2004-10-01), Itabashi et al.
patent: 2002/0064592 (2002-05-01), Datta et al.
patent: 61-183474 (1986-10-01), None
patent: 7-268638 (1995-10-01), None
patent: 2000-144438 (2000-05-01), None
“Electroless Copper Plating Using Glyoxylic Acid as a Reducing Agent,” Surface Technology, vol. 42, No. 9, pp. 913-917 (1991), no month available.
The 6th national convention record of Japan institute of Printed Circuit, pp. 101-102, no date available.

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