Electroless copper plating solution and process for formation of

Details Electroless copper plating solution and process for formation of Electroless copper plating solution and process for formation of

1989-12-29

1991-08-13

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 122, 106 123, 106 126, 427304, 427305, 427306, 427437, 4274431, C23C 1840, C23C 1838, C23C 1831, C23C 1854

Patent

active

050393383

ABSTRACT:
Disclosed are an electroless copper plating solution comprising a copper ion, a copper ion-complexing agent, a reducing agent and a pH-adjusting agent, the plating solution comprising a trialkanolmonoamine or a salt thereof as a complexing agent and accelerator in an amount giving a higher copper deposition speed than the copper deposition speed obtained when the trialkanolmonoamine or salt thereof is present in an amount sufficient to complex the copper ion but not enough to function as the accelerator, and 1.2.times.10.sup.-4 to 1.2.times.10.sup.-3 mole/l of an iron ion compound as a reaction initiator and/or 1.92.times.10.sup.-4 to 1.92.times.10.sup.-3 mole/l of at least one compound selected from the group consisting of pyridazine, methylpiperidine, 1,2-di-(2-pyridyl)ethylene, 1,2-di-(pyridyl)ethylene, 2,2'-dipyridylamine, 2,2'-bipyridyl, 2,2'-bipyrimidine, 6,6'-dimethyl-2,2'-dipyridyl, di-2-pyridylketone, N,N,N',N'-tetraethylethylenediamine, naphthalene, 1,8-naphthyidine, 1,6-naphthyridine, tetrathiafurvalene, .alpha.,.alpha.,.alpha.-terpyridine, phthalic acid, isophthalic acid and 2,2'-dibenzoic acid as an agent for improving the physical properties of a plating film, and a process for forming an electroless copper deposition film by using this electroless copper plating solution.

REFERENCES:
patent: 4265943 (1981-05-01), Goldstein et al.
patent: 4301196 (1981-11-01), McCormack et al.
patent: 4448804 (1984-05-01), Amelio et al.
patent: 4617205 (1986-10-01), Darken
patent: 4650691 (1987-05-01), Kinoshita et al.
patent: 4684545 (1987-08-01), Fey et al.
patent: 4834796 (1989-05-01), Kondo et al.
"Effects of Ligant to Rate of Electroless Copper Plating", translation of Tom 7, No. 5, 1971), English translation.
Francis J. Nuzzi, "Accelerating the Rate of Electroless Copper Plating" (Plating and Surface Finishing, Jan. 1983, pp. 51-53).
Derwent Abstract 86-295305/45 of JP 61-217581; Sep. 86, to Sumitomo Metal.
Derwent Abstract 88-074513/11 of JP 63-28877; Feb. 88, to Matsushita Electric.

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