Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Patent
1990-01-04
1991-12-31
Dixon, Jr., William R.
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
106 126, C23C 1840
Patent
active
050768409
ABSTRACT:
An electroless copper plating solution comprising a cupric salt, a copper complexing agent, a reducing agent, a pH adjustor, L-arginine and at least one of .alpha.,.alpha.'-dipyridyl and a cyano complex compound can give plated films high in ductility and adhesive strength and excellent in mechanical properties.
REFERENCES:
patent: 4171225 (1979-10-01), Molenaar et al.
patent: 4374876 (1983-02-01), El-Shazly et al.
patent: 4548644 (1985-10-01), Nakaso et al.
Akazawa Satoshi
Kuramoti Kazuichi
Shimazaki Takeshi
Takita Takao
Toyoda Hiroyuki
Dixon Jr. William R.
Hitachi Borden Chemical Products, Inc.
Hitachi Chemical Co. Ltd.
Klemanski Helene
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