Electroless copper plating solution

Details Electroless copper plating solution Electroless copper plating solution

1980-06-13

1981-12-01

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427437, 4274431, C23C 302

Patent

active

043034438

ABSTRACT:
When an amine compound having at least two polyolefin glycol chains in one molecule is used as a stabilizer, and an alkylene diamine compound, at least one hydrogen atom in the respective amino groups thereof being substituted by CH.sub.2 COOX (wherein X is H or Na) and another hydrogen atom in the respective amino group thereof being substituted by CH.sub.2 OH, is used as a complexing agent for cupric ions and a nitrogen-containing cyclic compound is used as a complexing agent for cuprous ions in an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent and a stabilizer, or an electroless copper plating solution comprising water, a water-soluble copper salt, a complexing agent for cupric ions, a reducing agent, a pH-controlling agent, a stabilizer and a complexing agent for cuprous ions, the plating rate of the electroless copper plating solution, mechanical strength of plating film, and stability of the plating solution are improved.

REFERENCES:
patent: 3310430 (1967-03-01), Schneble et al.
patent: 3751289 (1973-08-01), Arcilesi
patent: 3804638 (1974-04-01), Jonker et al.
patent: 3843373 (1974-10-01), Molenaar et al.
patent: 4002786 (1977-01-01), Hirohata et al.
patent: 4099974 (1978-07-01), Morishita et al.
patent: 4211564 (1980-07-01), Oka

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