Electroless copper plating solution

Details Electroless copper plating solution Electroless copper plating solution

1989-03-20

1990-09-11

Lieberman, Paul

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 105, 106 118, 106 126, 427305, 427 98, 204 521, C23C 1840, B05D 118

Patent

active

049560140

ABSTRACT:
A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methylpiperidine, and diethylaminoethanol.

REFERENCES:
patent: 4204013 (1980-05-01), Arcilesi et al.
patent: 4228213 (1980-10-01), Backenbaugh et al.
patent: 4301196 (1981-11-01), McCormack et al.
patent: 4303443 (1981-12-01), Miyazawa et al.
patent: 4814009 (1989-03-01), Kondo et al.
patent: 4834796 (1989-05-01), Kondo et al.

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