Electroless copper plating solution

Details Electroless copper plating solution Electroless copper plating solution

1987-11-13

1989-03-21

Lieberman, Paul

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 105, 106 118, 106 126, 427437, 427305, 427 98, 204 521, C23C 1840, B05D 118

Patent

active

048140090

ABSTRACT:
A practically fast electroless copper plating solution is provided by adding a specific monoamine as an accelerator. The accelerator should be a tertiary monoamine and cannot be a diamine, does not have a complexing ability for copper ion, and does not contain a ketone or carboxyl group or an unsaturated group. Specific examples of such monoamines include triethylamine, tripropylamine, tribenzylamine, N-methyl-piperidine, and tris (4-bromophenyl) amine, N-methylmorpholine.

REFERENCES:
patent: 4204013 (1980-05-01), Arcilesi et al.
patent: 4228213 (1980-10-01), Backenbaugh et al.
patent: 4301196 (1981-11-01), McCormack et al.
patent: 4303443 (1981-12-01), Miyazawa et al.
Abstract of Japanese Unexamined Patent Publication (Kokai) Nos. 56-271, 56-272, and 57-9865.
Ser. No. 573,626, Jan. 25, 1984.
Ser. No. 68,366, Jul. 1, 1987, Koji Kondo et al.

Affiliated with

Also associated with

Rating

Electroless copper plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless copper plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless copper plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-475015