Electroless copper plating solution

Details Electroless copper plating solution Electroless copper plating solution

1984-06-22

1986-01-07

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427437, 4274431, C23C 302

Patent

active

045632170

ABSTRACT:
An electroless copper plating solution comprising cupric ions, complexing agents, a reducing agent, a pH adjustor, a polyoxyethylene series surface active agent, these being conventionally used, and (i) an inorganic compound containing at least Si or Ge, or (ii) a cationic surface active agent, or (iii) an inorganic compound containing at least Si, Ge or V and a cationic surface active agent, can give plated films with excellent mechanical properties even if operated for a long period of time with excellent stability of the plating solution.

REFERENCES:
patent: 3615733 (1971-10-01), Shipley et al.
patent: 3804638 (1974-04-01), Jonker et al.
patent: 3915717 (1975-10-01), Feldstein et al.
patent: 4248633 (1981-02-01), Heijnen et al.
patent: 4371397 (1983-02-01), Honma et al.

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