Electroless copper plating solution

Details Electroless copper plating solution Electroless copper plating solution

1984-07-30

1985-12-10

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 302

Patent

active

045577625

ABSTRACT:
An electroless copper plating solution comprising cupric ions, a complexing agent, a reducing agent, a pH adjuster, a perfluoropolyether, a cyanide and/or .alpha.,.alpha.'-dipyridyl and/or 1,10-phenanthroline or a derivative thereof is capable of forming a deposited film with high elongation.

REFERENCES:
patent: 3095309 (1963-06-01), Zeblisky et al.
patent: 3607317 (1971-09-01), Schneble, Jr.
patent: 4059451 (1977-11-01), Oita et al.
patent: 4099974 (1978-07-01), Morishita et al.
Montefluos, Fomblin, Perfluoro Polyethers, Lubricants for Surface Lubrication of Magnetic Media

Affiliated with

Also associated with

Rating

Electroless copper plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless copper plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless copper plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-57107