Electroless copper plating process with dissolved oxygen maintai

Details Electroless copper plating process with dissolved oxygen maintai Electroless copper plating process with dissolved oxygen maintai

1978-03-10

1979-05-01

Smith, John D.

Coating processes

Measuring, testing, or indicating

106 126, 106 23, 427 97, 427 98, 427345, 427430A, 427437, C23C 302

Patent

active

041524675

ABSTRACT:
Copper is electrolessly deposited on a surface wherein the dissolved oxygen content is maintained between 2 and 4 ppm in the plating bath.

REFERENCES:
patent: 2938805 (1960-05-01), Agens
patent: 3300335 (1967-01-01), Horvath
patent: 3348969 (1967-10-01), Katz
patent: 3895137 (1975-07-01), Avramidis
patent: 3900599 (1975-08-01), Feldstein
patent: 3959531 (1976-05-01), Schneble et al.

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