Electroless copper plating process and apparatus

Details Electroless copper plating process and apparatus Electroless copper plating process and apparatus

1990-03-14

1991-12-31

Beck, Shrive

Coating processes

Immersion or partial immersion

Metal base

427438, 4274431, 427347, 427 57, 118425, C23C 2600

Patent

active

050770993

ABSTRACT:
An electroless metal plating process, particularly for use in plating through-holes in printed circuit substrates, and more particularly for additively depositing copper metal on through-hole surfaces, in which the substrate is at least intermittently subjected to vibrating motion in contact with the electroless depositing bath, and an electroless metal depositing apparatus for carrying out the process.

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patent: 4756930 (1988-07-01), Kukanskis et al.
Doubrava, Jeffrey J. "The `Black Hole` and Beyond: The Production of Void-Free Plated Through Holes", Aug. 1985 pp. 14-29, PC FAB.
D'Ambrisis, Joseph J., et al., "The Chemistry of Plating Small Diameter Holes--Part I", Apr. 1989, PC FAB.
D'Ambrisi, Joseph J., et al., "The Chemistry of Plating Small Diameter Holes--Part II", Aug. 1989, PC FAB.
Kukanskis, Peter E., "Improved Smear Removal", Mar. 1983, Printed Circuits.
Electronic Chemicals News (Approx. Jan. 1989).

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