Electroless copper plating bath and method

Details Electroless copper plating bath and method Electroless copper plating bath and method

1984-09-24

1987-03-17

Smith, John D.

Coating processes

Measuring, testing, or indicating

106 123, 106 126, 427437, 4274431, C23C 1840

Patent

active

046506918

ABSTRACT:
An electroless copper plating bath is prepared by adding both a metal-cyano-complex used as a stabilizer and an agent for complexing the metal of the metal-cyano-complex to an electroless copper plating bath containing cupric ion, an agent for complexing the cupric ion and a reducing agent, and an article to be plated is immersed in the bath.

REFERENCES:
patent: 4096301 (1978-06-01), Slominski et al.
patent: 4171225 (1979-10-01), Molenaar et al.
patent: 4548644 (1985-10-01), Nakaso et al.

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