Electroless copper plating bath and improved stability

Details Electroless copper plating bath and improved stability Electroless copper plating bath and improved stability

1985-10-09

1987-04-07

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 4274431, C23C 302

Patent

active

046558330

ABSTRACT:
An electroless copper plating bath having improved stability which contains a cationic polymer from acrylamide and/or methacrylamide. The plating bath also contains a cupric ion source, a reducing agent for the cupric ion source, and a complexing agent for the cupric ion.

REFERENCES:
patent: 3257215 (1966-06-01), Schneble et al.
patent: 3329512 (1967-07-01), Shipley et al.
patent: 3844799 (1974-10-01), Underkofler et al.

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