Electroless copper plating bath

Details Electroless copper plating bath Electroless copper plating bath

1992-11-30

1994-03-29

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 1840

Patent

active

052980588

ABSTRACT:
An electroless copper plating bath comprises a water soluble copper salt, a complexing agent, and a reducing agent consisting of phosphorous acid or a phosphite. As compared with conventional acidic bath using hypophosphorous acid, the bath is less expensive while depositing a uniform copper film at equivalent efficiency.

REFERENCES:
patent: 2965551 (1960-12-01), Richaud
patent: 3615736 (1971-10-01), Stone
patent: 4482596 (1984-11-01), Gulla et al.

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