Electroless copper plating bath

Details Electroless copper plating bath Electroless copper plating bath

1988-03-08

1989-04-04

Lieberman, Paul

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427304, 427437, 4274431, C23C 1838, B05D 310

Patent

active

048182869

ABSTRACT:
An electroless copper plating bath contains copper sulfate, EDTA, DMAB and triethanolamine and is adjusted to a pH in the range between approximately 8 and 9. The addition of cyanide ions alone or preferably with a sulfur compound such as thiodipropionic acid or a nitrogen compound such as 1,10 phenanthroline provided bright copper deposits. The use of an electroless plating bath operating at a low pH permits electroless plating of alkali sensitive substrates.

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patent: 4640718 (1987-02-01), Alnot et al.
patent: 4643793 (1987-02-01), Nakaso et al.
patent: 4650691 (1987-03-01), Kinoshita et al.

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