Electroless copper plating

Details Electroless copper plating Electroless copper plating

1996-09-18

1998-12-15

Lusignan, Michael

Coating processes

Electrical product produced

Condenser or capacitor

296021, 333167, 427123, 427125, 427299, 427304, 427305, 427309, B05D 512

Patent

active

058493557

ABSTRACT:
An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.

REFERENCES:
patent: 3765082 (1973-10-01), Zyetz
patent: 3833872 (1974-09-01), Marcus et al.
patent: 4310821 (1982-01-01), Frances
patent: 4313152 (1982-01-01), Vranken
patent: 4543553 (1985-09-01), Mandai et al.
patent: 4613843 (1986-09-01), Esper et al.
patent: 4626816 (1986-12-01), Blumkin et al.
patent: 4641114 (1987-02-01), Person
patent: 4730095 (1988-03-01), Richter-Jorgensen
patent: 4914260 (1990-04-01), Suzuki et al.
patent: 4918418 (1990-04-01), Tsala
patent: 4926292 (1990-05-01), Maple
patent: 4959631 (1990-09-01), Hasegawa et al.
patent: 4999597 (1991-03-01), Gaynor
patent: 5225969 (1993-07-01), Takaya et al.
patent: 5298687 (1994-03-01), Rapoport et al.
patent: 5358907 (1994-10-01), Wong
patent: 5363080 (1994-11-01), Breen
patent: 5380451 (1995-01-01), Rieger
patent: 5398400 (1995-03-01), Breen
patent: 5416356 (1995-05-01), Staudinger et al.
patent: 5532667 (1996-07-01), Haertling et al.
Monolithic Multicomponents Ceramic (MMC) Substrate, by Utsumi et al., 1985, Tokyo, Japan.
PCT/US 96/15441 International Search Report, completed Jan. 22, 1997.
Dialog Computer Search related to EP 209816 and U.S. Patent No. 4,730,095.
Steinberg, An Alternative Technique for Producing Cofired Ceramic Circuits and Components, Ferrite Materials Information Data Book by Heraeus Inc., W. Conshohocken, PA (undated).

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