Electroless copper plating

Details Electroless copper plating Electroless copper plating

1984-09-17

1985-09-03

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 302

Patent

active

045390444

ABSTRACT:
An electroless copper plating solution containing, in aqueous medium, cupric ions, hydroxyl radicals, complexing agent for cupric ions, formaldehyde and a formaldehyde addition agent; wherein the molar ratio of each of copper and free formaldehyde to hydroxyl radical is between 1 to 10 and 1 to 40.

REFERENCES:
patent: 3728137 (1973-04-01), Shipley et al.
patent: 4171225 (1979-10-01), Molenaar et al.

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