Electroless copper deposition solutions with hypophosphite reduc

Details Electroless copper deposition solutions with hypophosphite reduc Electroless copper deposition solutions with hypophosphite reduc

1980-05-12

1982-04-20

Smith, John D.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

106 123, 106 126, 427437, 4274431, C23C 302

Patent

active

043259901

ABSTRACT:
Suitably complexed cupric solutions can deposit conductive copper films electrolessly on properly catalyzed non-conductive substrates, at plating bath pH values in the range of about 2.0 to 3.5, using a non-formaldehyde reducer such as hypophosphite. Certain conditions are critical to successful results: (1) ability of the complexer selected to chelate copper at pH values of 2.0 to 3.5 at elevated temperatures (140.degree. to 160.degree. F.); (2) avoidance of certain anions, such as halides and acetates, in significant concentrations in the plating solution; and (3) provision of an "active" catalytic surface on the non-conductive substrate.

REFERENCES:
patent: 3046159 (1962-07-01), Brookshire
patent: 3650777 (1972-03-01), Schneble, Jr. et al.
patent: 4209331 (1980-06-01), Kukanskis et al.
Saubestre, "Electroless Copper Plating", Technical Proceedings of the Golden Jubilee Convention of American Electroplaters Society, vol. 46, pp. 264-265; 1959.
Pearlstein et al., "Electroless Copper Plating Using Dimethylamine Borane", Plating, May 1973, pp. 474-476.
Fintschenko et al., "Electroless Copper Plating", Metal Finishing Jan., 1970.
Calley et al., "Metallizing Polymeric Coatings", IBM TDB, vol. 12, No. 2, Jul. 1969.

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