Electroless copper deposition solution using a hypophosphite red

Details Electroless copper deposition solution using a hypophosphite red Electroless copper deposition solution using a hypophosphite red

1979-08-27

1981-07-21

Smith, John D.

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

106 123, 427437, 4274431, C23C 302

Patent

active

042799481

ABSTRACT:
Electroless copper deposition solutions, and method of electrolessly depositing copper onto a workpiece using these solutions, are disclosed. The solutions contain, in addition to water as the usual solvent, a soluble source of copper ions, a complexing agent or mixture of agents to maintain the copper in solution, and a copper reducing agent effective to reduce the copper ions to metallic copper as a deposit or plating on a prepared surface of a workpiece brought into contact with the solution. The invention comprehends replacing the usual formaldehyde-type reducing agents of commercial electroless copper baths with inorganic non-formaldehyde-type agents, for example hypophosphites, by coordinating the particular complexing agents employed and the bath pH, to effect reduction of cupric ions to a metallic copper plating on a prepared surface of a substrate, wherein the resulting electroless metal deposit has conductive properties at least satisfactory for build-up of additional thickness of metal by standard electroplating techniques. Improvement over the prior formaldehyde-reduced electroless copper solutions is obtained in that the invention teaches those skilled in the art how to achieve satisfactory copper deposition over longer periods of bath operation than has been practical heretofore. Fluctuations in component concentration and bath temperatures are inherent and unavoidable in the course of commercial use of the bath and these are normally detrimental to protracted use of formaldehyde-reduced copper solutions. In the present invention, bath stability is maintained better, in spite of these inherent fluctuations.

REFERENCES:
patent: 3650777 (1972-03-01), Schneble, Jr. et al.
patent: 3870526 (1975-03-01), Pearlstein et al.
patent: 4138267 (1979-02-01), Arisato et al.
Saubestre, "Electroless Copper Plating", AES, 46, pp. 264, 265, 1959.
Purhpavanam, "Electroless Copper Plating", Finishing Industries, Oct. 1977, pp. 36-43.
Feldstein, "Fabrication of Semitransparent Masks", J. Electrochemical Soc., vol. 120, pp. 1654-1657, (Dec. 1973).
Saubestre, "Electroless Copper Plating in Printed Circuitry", The Sylvania Technologist, XII, No. 1, Jan. 1959.
Fintschenko et al. "Electroless Copper Plating", Metal Finishing, Jan. 1970, pp. 85-87.
Pearlstein et al., "Electroless Copper Plating Using Dimethylamine Borane", Plating, May 1973.

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