Electroless copper deposition solution

Details Electroless copper deposition solution Electroless copper deposition solution

1983-09-23

1985-10-22

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 302

Patent

active

045486441

ABSTRACT:
An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.

REFERENCES:
patent: 3095309 (1963-06-01), Zeblisky et al.
patent: 3607317 (1971-09-01), Schneble
patent: 4099974 (1978-07-01), Morishita et al.
patent: 4303443 (1981-12-01), Miyazawa et al.

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