Coating processes – With pretreatment of the base – Preapplied reactant or reaction promoter or hardener
Patent
1980-09-26
1981-11-17
Smith, John D.
Coating processes
With pretreatment of the base
Preapplied reactant or reaction promoter or hardener
106 123, 427345, 4274431, 427 98, C23C 302
Patent
active
043011969
ABSTRACT:
There is provided a method for increasing the useful effective plating rate of an electroless copper deposition solution which comprises copper ion, a complexing agent for copper ion, a reducing agent and a pH adjustor and which is characterized by a plating rate which first increases and passes through a peak plating rate and then decreases as a function of a pH above 10. In accordance with this invention, the plating rate of such a solution may be significantly increased by operation thereof in the presence of an accelerating or depolarizing agent at a pH to achieve a plating rate above the plating rate of the solution without such an agent at the same pH. The accelerating or depolarizing agents for use herein include compounds containing a delocalized pi-bond, such as heterocyclic aromatic nitrogen and sulfur compounds, non-aromatic nitrogen compounds having at least one delocalized pi-bond, and aromatic amines.
REFERENCES:
patent: 3222195 (1965-12-01), Pearlstein
patent: 3257215 (1966-06-01), Schneble et al.
patent: 3377174 (1968-04-01), Torigai et al.
patent: 3436233 (1969-04-01), Jackson
patent: 3645749 (1972-02-01), Paunovic
patent: 3708329 (1973-01-01), Schoenberg
patent: 3793038 (1974-02-01), Maguire
patent: 3804638 (1974-04-01), Jonker et al.
patent: 3843373 (1974-10-01), Molenaac et al.
patent: 4002786 (1977-01-01), Hirohata et al.
Jonker et al., "Principles of PD Recording Systems and Their Use in Photofabrication", Journal of Photographic Science, 19, 1971.
Pushpavanam et al., "Electroless Copper Plating" Finishing Industries, vol. 1, No. 10, Oct. 1977 pp. 36, 37, 43.
Pearlstein, "Electroless Plating", Modern Electroplating, John Wiley & Sons, .COPYRGT.1974 pp. 734-739.
McCormack John F.
Nuzzi Francis J.
Kollmorgen Technologies Corp.
Smith John D.
LandOfFree
Electroless copper deposition process having faster plating rate does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroless copper deposition process having faster plating rate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless copper deposition process having faster plating rate will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1292803