Electroless copper compositions

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C106S001260, C427S097900, C427S443100

Reexamination Certificate

active

07611569

ABSTRACT:
Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

REFERENCES:
patent: 3992211 (1976-11-01), Skoll
patent: 4002786 (1977-01-01), Hirohata et al.
patent: 4009087 (1977-02-01), Kardos et al.
patent: 4099974 (1978-07-01), Morishita et al.
patent: 4133908 (1979-01-01), Madsen
patent: 4192764 (1980-03-01), Madsen
patent: 4211564 (1980-07-01), Oka
patent: 4248633 (1981-02-01), Heijnen et al.
patent: 4303443 (1981-12-01), Miyazawa et al.
patent: 4371397 (1983-02-01), Honma et al.
patent: 4450191 (1984-05-01), Arcilesi
patent: 4548644 (1985-10-01), Nakaso et al.
patent: 4557762 (1985-12-01), Nakaso et al.
patent: 4559166 (1985-12-01), Morinaga et al.
patent: 4563217 (1986-01-01), Kikuchi et al.
patent: 4581256 (1986-04-01), Sommer
patent: 4695505 (1987-09-01), Dutkewych
patent: 4777078 (1988-10-01), Miyabayashi
patent: 4834796 (1989-05-01), Kondo et al.
patent: 5021135 (1991-06-01), Wilson et al.
patent: 5039338 (1991-08-01), Kondo et al.
patent: 5076840 (1991-12-01), Takita et al.
patent: 5358992 (1994-10-01), Dershem et al.
patent: 5419926 (1995-05-01), Soltys
patent: 5425873 (1995-06-01), Bladon et al.
patent: 5620961 (1997-04-01), Markovic et al.
patent: 5789507 (1998-08-01), Tanaka et al.
patent: 5795828 (1998-08-01), Endo et al.
patent: 5897692 (1999-04-01), Kotsuka et al.
patent: 5965211 (1999-10-01), Kondo et al.
patent: 6107426 (2000-08-01), Shibutani
patent: 6183545 (2001-02-01), Okuhama et al.
patent: 6416812 (2002-07-01), Andricacos et al.
patent: 6627544 (2003-09-01), Izumi et al.
patent: 6660071 (2003-12-01), Yoshida et al.
patent: 6664122 (2003-12-01), Andryuschenko et al.
patent: 6805915 (2004-10-01), Itabashi et al.
patent: 6855378 (2005-02-01), Narang
patent: 2002/0152955 (2002-10-01), Dordi et al.
patent: 2003/0183120 (2003-10-01), Itabashi et al.
patent: 2007/0071904 (2007-03-01), Yabe et al.
patent: 2008/0038449 (2008-02-01), Poole et al.
patent: 2008/0038450 (2008-02-01), Poole et al.
patent: 2008/0038451 (2008-02-01), Poole et al.
patent: 2009/0022885 (2009-01-01), Matsumoto et al.
patent: 1 411 147 (2004-04-01), None
patent: 1 397 091 (1972-07-01), None
patent: 05148662 (1993-06-01), None
patent: 1997316649 (1997-09-01), None
patent: 1998072677 (1998-03-01), None
patent: 2001148561 (2001-05-01), None
patent: WO 2005/038086 (2005-04-01), None
patent: WO 2005/038087 (2005-04-01), None
patent: WO 2005/038088 (2005-04-01), None
Abstract of JP 05/148662, Jun. 1993.
Abstract of WO 2006/085669; Pub date Aug. 17, 2006; International filing date Feb. 8, 2006.
Baum, et al., “Photoselective Plating of Metals for Circuitization and Top-surface Imaging”, pp. 335-343, (date and publisher unavailable).
Sone, et al., “Electroless Copper Plating Using Fe11as a Reducing Agent”, Science Direct, Electrochimica Acta 49 (2004), pp. 233-238, www.sciencedirect.com.
Terskaya, et al., “Electroless Nickel and Copper Plating of Carbon Fibers with the Use of Sulfur-containing Reducing Agents”, Russian Journal of Applied Electrochemistry, vol. 77, No. 2 (2004), pp. 236-240.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electroless copper compositions does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless copper compositions, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless copper compositions will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4078175

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.