Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2005-05-03
2005-05-03
Chervinsky, Boris (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C257S714000, C257S715000, C174S015100, C165S080400
Reexamination Certificate
active
06888721
ABSTRACT:
Means for cooling a heated surface comprising an enclosure for enclosing the heated surface and two interleaved radial arrays of micro electrodes positioned on the surface within the enclosure thereby forming an interleaved radial array. The radial array has a ‘near-vertex’ end and a periphery. The micro electrodes at the near-vertex end have a smaller interelectrode distance and the micro electrodes at the periphery have a larger interelectrode distance. A volatile cooling liquid is contained within the enclosure and moved from the near-vertex array end toward the periphery along the lengths of micro electrodes by non-alternating voltages applied to the micro electrodes, thereby creating a polarization effect and evaporation of the volatile liquid.
REFERENCES:
patent: 6437981 (2002-08-01), Newton et al.
patent: 6443704 (2002-09-01), Darabi et al.
patent: 6601643 (2003-08-01), Cho et al.
patent: 6650542 (2003-11-01), Chrysler et al.
patent: 6741469 (2004-05-01), Monfarad
patent: 20030062149 (2003-04-01), Goodson et al.
Moghaddam Saeed
Ohadi Michael M.
Atec Corporation
Chervinsky Boris
Kramer Daniel
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