Pipe joints or couplings – With assembly means or feature – Molded joint facilitator
Reexamination Certificate
2006-12-05
2006-12-05
Hewitt, James M. (Department: 3679)
Pipe joints or couplings
With assembly means or feature
Molded joint facilitator
C285S021100, C219S542000, C219S544000, C156S304200
Reexamination Certificate
active
07144045
ABSTRACT:
An electrofusion joint assembly includes a meltable member, such as a pipe or fitting, and a heating element secured to the pipe or fitting. The pipe or fitting may be tapered to facilitate receiving another pipe to form an electrofusion weld joint. Fasteners are used to secure the heating element and extend through a meltable zone and into a non-melt zone. Power supplied to the pipe melts the pipe proximal the heating element.
REFERENCES:
patent: 3061503 (1962-10-01), Gould et al.
patent: 3062940 (1962-11-01), Bauer et al.
patent: 3112771 (1963-12-01), Bringolf et al.
patent: 3422179 (1969-01-01), Holzer
patent: 3730373 (1973-05-01), Kozbelt
patent: 3788928 (1974-01-01), Wise
patent: 3907625 (1975-09-01), Vogelsanger
patent: 3943334 (1976-03-01), Sturm
patent: 3998682 (1976-12-01), Harmsen
patent: 4449038 (1984-05-01), Reich et al.
patent: 4510004 (1985-04-01), Hawerkamp
patent: 4530521 (1985-07-01), Nyffeler et al.
patent: 4622087 (1986-11-01), Ansell
patent: 4626308 (1986-12-01), Ansell
patent: 4628966 (1986-12-01), Kanao
patent: 4630846 (1986-12-01), Nishino et al.
patent: 4770442 (1988-09-01), Sichler
patent: 4842305 (1989-06-01), Kistenich et al.
patent: 4865674 (1989-09-01), Durkin
patent: 4927183 (1990-05-01), Steinmetz et al.
patent: 4927184 (1990-05-01), Bourjot et al.
patent: 4929817 (1990-05-01), Mito et al.
patent: 5046531 (1991-09-01), Kanao
patent: 5107098 (1992-04-01), D'Auria
patent: 5150922 (1992-09-01), Nakashiba et al.
patent: 5169176 (1992-12-01), Brossard
patent: 5324920 (1994-06-01), Nakao
patent: 5364130 (1994-11-01), Thalmann
patent: 5369248 (1994-11-01), Dufour et al.
patent: 5390704 (1995-02-01), Kanao
patent: 5433484 (1995-07-01), Ewen et al.
patent: 5454061 (1995-09-01), Carlson
patent: 5674588 (1997-10-01), Porfido et al.
patent: 5687996 (1997-11-01), Steinmetz et al.
patent: 5824179 (1998-10-01), Greig
patent: 5836621 (1998-11-01), Campbell
patent: 5911895 (1999-06-01), Porfido et al.
patent: 5988689 (1999-11-01), Lever
patent: 6131954 (2000-10-01), Campbell
patent: 6135508 (2000-10-01), Genoni et al.
patent: 6250686 (2001-06-01), Becker et al.
patent: 6428054 (2002-08-01), Zappa et al.
patent: 6781099 (2004-08-01), Krah
patent: 239018 (1965-03-01), None
patent: 217080 (1956-11-01), None
patent: 1479231 (1969-03-01), None
patent: 2207060 (1974-06-01), None
patent: 2817243 (1979-10-01), None
patent: 3213551 (1983-10-01), None
patent: 3226575 (1984-03-01), None
patent: 3103305 (1984-06-01), None
patent: 3437940 (1986-04-01), None
patent: 263022 (1988-12-01), None
patent: 4214279 (1993-11-01), None
patent: 33788 (1981-08-01), None
patent: 0780620 (1997-06-01), None
patent: 939664 (1963-10-01), None
patent: 1121850 (1968-07-01), None
patent: 1214632 (1970-12-01), None
patent: 2135746 (1984-09-01), None
patent: 2135747 (1984-09-01), None
patent: 4636118 (1971-10-01), None
patent: 2190694 (1990-07-01), None
patent: 5164286 (1993-06-01), None
patent: 5164288 (1993-06-01), None
patent: 5272689 (1993-10-01), None
patent: 6281078 (1994-10-01), None
patent: 7253186 (1995-10-01), None
patent: 7332571 (1995-12-01), None
patent: 8156018 (1996-06-01), None
patent: 9257183 (1997-09-01), None
patent: 9280466 (1997-10-01), None
patent: 10246382 (1998-09-01), None
patent: 11315987 (1999-11-01), None
patent: 24681 (1969-11-01), None
Hewitt James M.
Karl-Heinz Krah GmbH
Roylance,Abrams,Berdo & Goodman, L.L.P.
LandOfFree
Electrofusion socket forming system does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrofusion socket forming system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrofusion socket forming system will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3711590