Electroformed thin-wall cutting saw impregnated with abrasives

Details Electroformed thin-wall cutting saw impregnated with abrasives Electroformed thin-wall cutting saw impregnated with abrasives

2008-09-04

2009-11-10

Rachuba, Maurina (Department: 3727)

Stone working

Sawing

Rotary

C125S018000

Reexamination Certificate

active

07614395

ABSTRACT:
The present invention describes electroformed thin-wall nickel cutting saws or blades that are impregnated with diamond abrasives. The thin-wall saws are formed with a plurality of raised portions and an equal plurality of recessed portions, with each raised portion alternating with a recessed portion, the raised and recessed portions are substantially parallel and are connected by transition portions. In another embodiment, some of the transition regions are formed with intermediate steps or partially raised and recessed portions. These intermediate steps or partially recessed and raised portions allow more uniform distribution of matrix material across a kerf width D1as the cutting saw is spun, thereby, giving the cut edge a substantially square profile.

REFERENCES:
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patent: 5316416 (1994-05-01), Kim
patent: 5667423 (1997-09-01), Itoi
patent: 6273082 (2001-08-01), Tselesin
patent: 6561177 (2003-05-01), Ball
patent: 6641381 (2003-11-01), Ball
NN 75012448, “Electroformed Multiple Bladed Diamond Saw”, IBM Technical Disclosure Bulletin, Jan. 1, 1975, US, vol. 17, Iss. 8, pp. 2448-2449.
Gideon Levinson, Considerations For MLP/QFN Substrate Singulation, Kulicke & Sofa, Haifa, Israel.
Ramon J. Albalak, “Package Singulation Processes”, Advanced Dicing Technologies, in Information Communication Technology, GDS Publishing, 2008.

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