Electroformed high efficiency heat exchanger and method for maki

Details Electroformed high efficiency heat exchanger and method for maki Electroformed high efficiency heat exchanger and method for maki

1991-05-31

1993-04-06

Flanigan, Allen J.

Heat exchange

Conduit within, or conforming to, panel or wall structure

165170, 165 804, F28F 300

Patent

active

051994879

ABSTRACT:
Electroformed high efficiency heat exchanger structure (44) is created by micro-machining and plating methods by creating a form, making holes therein, plating all over including through the holes, machining the assembly to shape, and thereupon dissolving out the form to form the microchannel structure without burrs. Manifolds (40, 42) are attached. The heat exchanger structure is preferably used where compact and high heat rates or power density requirements are present.

REFERENCES:
patent: 997610 (1911-02-01), Feldkamp
patent: 2024521 (1935-12-01), Harrison
patent: 2540805 (1951-02-01), Beebe
patent: 2859509 (1958-11-01), Adams
patent: 2966729 (1961-01-01), Dedrick
patent: 3435504 (1969-04-01), Miller
patent: 4253520 (1981-03-01), Friedericy et al.
patent: 4938280 (1990-07-01), Clark

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