Electroformed hermetic glass-metal seal

Details Electroformed hermetic glass-metal seal Electroformed hermetic glass-metal seal

1974-11-18

1976-01-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

294731, 204 40, C25D 502, C25D 510, B23K 3102

Patent

active

039322270

ABSTRACT:
Disclosed is an improved method of bonding two glass-like structures or a glass-like and a metallic structure, and an improved bond which may be fabricated by this method. In the preferred embodiment, the mating surfaces are first metalized with a thin titanium layer, which is covered by a thin gold layer. The metalized surfaces are joined, and a gold layer is electro-deposited over the junction in an overlapping fashion. Finally a nickel layer is electro-deposited over the gold layer.

REFERENCES:
patent: 2569368 (1951-09-01), Bradner et al.
patent: 3412455 (1968-11-01), Bronnes et al.
patent: 3415556 (1968-12-01), Dryden
patent: 3432913 (1969-03-01), Bronnes et al.
patent: 3632008 (1972-01-01), Lind
patent: 3671406 (1972-06-01), Mattia et al.

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