Electroding of ceramic piezoelectric transducers

Details Electroding of ceramic piezoelectric transducers Electroding of ceramic piezoelectric transducers

1996-06-26

1998-05-26

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156221, 156233, 156241, 156276, 29 2535, 310311, 310365, B32B 3112, B32B 3120

Patent

active

057559090

ABSTRACT:
In the embodiments described in the specification, electrodes are bonded to the surface of a ceramic piezoelectric layer by supporting electrodes having a reduced dimension on a flexible dielectric film and placing the dielectric film under tension to expand the film and the electrodes sufficiently to conform the electrodes to the desired electrode pattern on the ceramic piezoelectric layer. The electrodes are then bonded to the piezoelectric layer with an adhesive bonding agent under pressure applied hydraulically so as to be distributed uniformly throughout the surface of the piezoelectric layer. In one embodiment the dielectric film also carries conductor arrays for connecting the electrodes to remote driver chips at locations spaced from the surface of the piezoelectric layer.

REFERENCES:
patent: 5210455 (1993-05-01), Takeuchi et al.
patent: 5291460 (1994-03-01), Harada et al.
patent: 5605659 (1997-02-01), Moynihan et al.

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