Electrodes, inner layers, capacitors, electronic devices and...

Details Electrodes, inner layers, capacitors, electronic devices and... Electrodes, inner layers, capacitors, electronic devices and...

2006-06-15

2010-06-22

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Making passive device

Stacked capacitor

C257S532000

Reexamination Certificate

active

07741189

ABSTRACT:
A method of embedding thick-film fired-on-foil capacitors includes entirely covering the dielectric with an encapsulating electrode to avoid cracking in the dielectric due to shrinkage and temperature coefficient of expansion differences between the electrode and dielectric.

REFERENCES:
patent: 6370013 (2002-04-01), Iino et al.
patent: 6631551 (2003-10-01), Bowles et al.
patent: 2004/0023361 (2004-02-01), Gaier et al.
patent: 2004/0099999 (2004-05-01), Borland
Search Report for corresponding European patent application No. 06253168.6, dated Oct. 16, 2006.
U.S. Appl. No. 10/801,326, filed Mar. 16, 2004, Borland et al.
U.S. Appl. No. 10/801,257, filed Mar. 16, 2004, Borland et al.

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