Electrodeposition without internal deposit stress

Details Electrodeposition without internal deposit stress Electrodeposition without internal deposit stress

1988-01-05

1988-11-22

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204231, C25D 100, C25D 1700

Patent

active

047863765

ABSTRACT:
An apparatus and method are described for electrodepositing an electroform with near zero internal stress. A voltage controlled power supply supplies current to both a mandrel, upon which a primary electroform is deposited, and to a deformable thin disk substrate, upon which a secondary deposit is formed. A strain gage on the deformable substrate measures any deformation caused by internal stress in the secondary deposit. The strain gage is connected to a strain gage transducer to produce an output signal to a proportional controller. The proportional controller in turn supplies a strain-proportional voltage signal to the power supply. A current mask ensures an even current density over the mandrel. After initially adjusting electroforming bath parameters to provide a zero internal stress in the starting electroform, the output from the strain gage causes proportional changes in the bath current to the mandrel to maintain a constant near zero internal stress in the primary electroform.

REFERENCES:
patent: 2706170 (1955-04-01), Marchese
patent: 3437568 (1969-04-01), Hasselmann et al.
patent: 3485725 (1969-12-01), Koretzky
patent: 3570449 (1971-03-01), Blecherman et al.
patent: 3876510 (1975-04-01), Wallin et al.
patent: 3954568 (1976-05-01), DuPree
patent: 3963587 (1976-06-01), Kreckel
patent: 4501646 (1985-02-01), Herbert
patent: 4648944 (1987-03-01), George et al.

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