Electrodeposition of copper

Details Electrodeposition of copper Electrodeposition of copper

1977-05-04

1978-08-29

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 44, 260 292EP, 528424, C25D 338

Patent

active

041101766

ABSTRACT:
A composition and method for electrodepositing ductile, bright, well leveled copper deposits from an aqueous acidic copper plating bath having dissolved therein from about 0.04 to about 1000 milligrams per liter of a poly (alkanol quaternary ammonium salt) formed as the reaction product of a polyalkanolamine with an alkylating or quaternization agent. The polyalkanolamine constituent typically is formed as the reaction product of a polyalkylenimine (e.g. polyethylenimine) with an alkylene oxide.

REFERENCES:
patent: 2272489 (1942-02-01), Ulrich
patent: 2296225 (1942-09-01), Ulrich
patent: 3030282 (1962-04-01), Passal
patent: 3313736 (1967-04-01), Dickson et al.
patent: 3770598 (1973-11-01), Creutz

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