Electrodeposition of copper

Details Electrodeposition of copper Electrodeposition of copper

1974-11-21

1976-05-11

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

039561208

ABSTRACT:
This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:

REFERENCES:
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patent: 3542655 (1970-11-01), Kardos et al.
patent: 3650915 (1972-03-01), Quimby et al.
patent: 3682788 (1972-08-01), Kardos et al.
patent: 3732151 (1973-05-01), Abbott

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