Electrodeposition of copper

Chemistry: electrical and wave energy – Processes and products

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C25D 338

Patent

active

039560783

ABSTRACT:
This invention relates to novel compositions and to a process for electrodepositing copper from an aqueous acidic copper plating bath containing at least one member independently selected from each of the following two groups:

REFERENCES:
patent: 2849351 (1958-08-01), Gundel et al.
patent: 2849352 (1958-08-01), Kirstahler et al.
patent: 3000800 (1961-09-01), Strauss et al.
patent: 3023150 (1962-02-01), Willmund et al.
patent: 3081240 (1963-03-01), Strauss et al.
patent: 3267010 (1966-08-01), Creutz et al.
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3542655 (1970-11-01), Kardos et al.
patent: 3650915 (1972-03-01), Quimby et al.
patent: 3682788 (1972-08-01), Kardos et al.
patent: 3732151 (1973-05-01), Abbott

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrodeposition of copper does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrodeposition of copper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrodeposition of copper will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1300825

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.