Electrodeposition of copper

Details Electrodeposition of copper Electrodeposition of copper

1976-02-13

1977-10-11

Edmundson, F.C.

Chemistry: electrical and wave energy

Processes and products

Electrostatic field or electrical discharge

204 52R, 204108, 204275, C25C 112, C25C 700, C25D 338, C25D 1700

Patent

active

040533778

ABSTRACT:
The invention consists of a method for electrowinning or electrorefining of metals, particularly copper, comprising electrodepositing the metal from an electrolyte solution under conditions comprising high cathode and anode current densities and high velocity flow of electrolyte past the electrode surfaces. Current densities of about 60 to 400 amp/sq ft are employed, with electrolyte flow rates of at least 75 ft/min, preferably about 150 to 400 ft/min.

REFERENCES:
patent: 2445675 (1948-07-01), Lang
patent: 2535966 (1950-12-01), Teplitz
patent: 2592810 (1952-04-01), Kushner
patent: 3003939 (1961-10-01), Rouy et al.
patent: 3506546 (1970-04-01), Semienko et al.
patent: 3535222 (1970-10-01), Cooke et al.
Wesley et al., Proceeding American Electroplaters Society, vol. 36, pp. 80, 81, 82, 91 (1949).

Affiliated with

Also associated with

Rating

Electrodeposition of copper does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrodeposition of copper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrodeposition of copper will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-738020