Electrodeposition of bright copper

Details Electrodeposition of bright copper Electrodeposition of bright copper

1981-03-26

1982-06-22

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

C25D 338

Patent

active

043361145

ABSTRACT:
A composition and method for electrodepositing ductile, bright, level copper deposits from an aqueous acidic copper plating electrolyte particularly suited for plating electronic circuit boards containing a brightening and leveling amount of a brightening and leveling system comprising (a) a bath soluble substituted phthalocyanine radical, (b) a bath soluble adduct of a tertiary alkyl amine with polyepichlorohydrin, (c) a bath soluble organic divalent sulfur compound, and (d) a bath soluble reaction product of polyethyleneimine and an alkylating agent which will alkylate the nitrogen on the polyethyleneimine to produce a quaternary nitrogen. The electrolyte optionally also contains bath soluble polyether compounds as a supplemental brightening agent.

REFERENCES:
patent: 3267010 (1966-08-01), Creutz et al.
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3770598 (1973-11-01), Creutz
patent: 4110176 (1978-08-01), Creutz et al.
patent: 4272335 (1981-06-01), Combs

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