Electrodeposited foil with controlled properties for printed cir

Details Electrodeposited foil with controlled properties for printed cir Electrodeposited foil with controlled properties for printed cir

1989-09-13

1993-06-01

Tufariello, T. M.

Electrolysis: processes, compositions used therein, and methods

Electroforming or composition therefor

Sheet, web, wire, or filament

428544, C25D 104

Patent

active

052156451

ABSTRACT:
Copper conductive foil for use in preparing printed circuit boards is electrodeposited from an electrolyte solution containing copper ions, sulphate ions, animal glue and thiourea. The thiourea operates to decrease the roughness of the foil, to enable operation at higher current densities and/or to modify the ductility characteristics of the foil.

REFERENCES:
patent: 2563360 (1951-08-01), Phillips et al.
patent: 3923109 (1966-12-01), Luce et al.
Ibl et al, Electrochimica Acta, 1972, vol. 17, pp. 733-739.
Knuutila, et al. "The Effect of Organic Additives on the Electrocrystallization of Copper", 1987, pp. 129-143.
Bucci, et al. "Foil Technology for PCB Fabrication: Foil Manufacturing & Developement for Advanced PCB Designs", presented at PCFAC EXPO '86 (May 12, 1986).
Afifi, et al, Journal of Metals, Feb. 1987, pp. 38-41.
Franklin, Surface and Coating Technology, 30, (1987) pp. 415-428.
Chia, et al, Journal of Metals, Apr. 1987, pp. 42-45.

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