Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent
1990-04-12
1991-08-13
Kaplan, G. L.
Stock material or miscellaneous articles
All metal or with adjacent metals
Composite; i.e., plural, adjacent, spatially distinct metal...
204 24, 204 431, 204 444, 420562, 420577, 428642, 428646, C25D 356, C25D 360, C25D 700
Patent
active
050395769
ABSTRACT:
An electroplating bath, cell and method for the electrodeposition of a wide range of tin-bismuth alloys onto a conductive substrate comprises tin and bismuth ion in aqueous solution, and an alkyl sulfonic or polysulfonic acid or salt as the electrolyte. The sulfonic component is present in amounts sufficient to maintain the bismuth in solution.
In the operation of the method of the invention, electroplated tin-bismuth eutectic alloys of controlled composition are obtained. The alloys of tin and bismuth contain amounts of both metals such that the plated alloy has a melting point substantially lower than that of either metal alone, and a melting point lower than that of a tin-lead alloy.
REFERENCES:
patent: 3198877 (1965-08-01), Olson et al.
patent: 3360446 (1967-12-01), Jongkind
patent: 3663384 (1972-05-01), Lescure
patent: 4252618 (1981-02-01), Grenda
patent: 4331518 (1982-05-01), Wilson
patent: 4565610 (1986-01-01), Nobel et al.
patent: 4717460 (1988-01-01), Nobel et al.
Atochem North America, Inc.
Henn Robert B.
Kaplan G. L.
Marcus Stanley A.
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