Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament
Patent
1993-05-28
1995-04-04
Niebling, John
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
Sheet, web, wire, or filament
205148, 205170, 205101, 428544, C25D 104
Patent
active
054034655
ABSTRACT:
This invention is directed to an electrodeposited copper foil having a matte-side raw foil R.sub.tm of about 4 to about 10 microns, an ultimate tensile strength measured at 23.degree. C. in the range of about 55,000 to about 80,000 psi, an elongation measured at 23.degree. C. of about 6% to about 25%, an ultimate tensile strength measured at 180.degree. C. in the range of about 30,000 psi to about 40,000 psi, an elongation measured at 180.degree. C. of about 4% to about 15%, and a thermal stability of less than about -20%. The invention is also directed to a process for making the foregoing foil, the process comprising: (A) preparing an electrolyte solution comprising copper ions, sulfate ions, chloride ions at a concentration of about 1.2 to about 4.5 ppm, at least one organic additive at a concentration of about 0.4 to about 20 ppm, and at least one impurity at a concentration of about 0.01 to about 20 grams per liter; (B) flowing said electrolyte solution between an anode and a cathode, and applying an effective amount of voltage across said anode and said cathode to deposit copper on said cathode, the current density being in the range of about 0.1 to about 3 A/cm.sup.2 ; and (C) removing copper foil from said cathode.
REFERENCES:
patent: 2475974 (1949-07-01), Max
patent: 2482354 (1949-09-01), Max et al.
patent: 2563360 (1951-08-01), Phillips et al.
patent: 2859159 (1958-11-01), Wernlund
patent: 2876178 (1959-03-01), McCoy
patent: 3585010 (1971-06-01), Luce et al.
patent: 3682788 (1972-08-01), Kardos et al.
patent: 3864227 (1975-02-01), Brytczuk et al.
patent: 4082591 (1978-04-01), Morisaki et al.
patent: 4088544 (1978-05-01), Hutkin
patent: 4169018 (1979-09-01), Berdan et al.
patent: 4386139 (1983-05-01), Nakatsugawa
patent: 4387006 (1983-06-01), Kajiwara et al.
patent: 4529486 (1985-07-01), Polan
patent: 4686017 (1987-08-01), Young
patent: 4834842 (1989-05-01), Langner et al.
patent: 4898647 (1990-02-01), Luce et al.
patent: 4956053 (1990-09-01), Polan et al.
patent: 4976826 (1990-12-01), Tani et al.
patent: 5049221 (1991-09-01), Wada et al.
patent: 5181770 (1993-01-01), Brock et al.
Chem Abstract, vol. 105, No. 2, Chem Abstract No. 14254j.
EPO Search Report for Application 91911599.8, mailed Feb. 9, 1993.
Lowenheim, "Modern Electroplating", Third Edition, 1974, pp. 196-197.
Bucci et al, "Copper Foil Technology," PC FAB, Jul., 1986, pp. 22-33.
Anderson et al, "Tensile Properties of Acid Copper Electrodeposits," Journal of Applied Electrochemistry 15, (1985), pp. 631-637.
Lakshmanan et al, "The Effect of Chloride Ion in the Electrowinning of Copper," Journal of Applied Electrochemistry 7 (1977), pp. 81-90.
Lamb et al, "Physical and Mechanical Properties of Electrodeposited Copper III-Deposits From Sulfate, Fluoborate, Pyrophosphate, Cyanide, and Amine Baths," Journal of the Electrochemical Society, Sep., 1970, pp. 291C-318C.
Lamb et al, "Physical and Mechanical Properties of Electrodeposited Copper--II. The Sulfate Bath,", Jan. 1966, pp. 86-95.
Lamb et al, "Physical and Mechanical Properties of Electrodeposited Copper--I. Literature Survey," Plating, Dec. 1965, pp. 1289-1311.
N. P. Fedot'ev, P. M. Vyacheslaovov et al, The Tensile Strength and Microhardness of Electrodeposited Copper, J. Applied Chem. (USSR), 37,691 (1964).
D. M. Lyde, "Copper Pyrophosphate Plating," Metal Industry (London), 101, 82 (1962).
G. W. Jernstedt, Leveling With PR Current Plating, Proc. Am. Electroplaters' Soc., 37, 151 (1950).
C. E. Heussner et al, "Some Metallurgical Aspects of Electrodeposits, Plating", 35, 554, 719 (1948).
G. W. Jernstedt, Brightener Finishes via PR Plating, Westinghouse Engr., 10, No. 3, 139 (1943).
C. W. Bennett, Tensile Strength of Electrolytic Copper on a Rotating Cathode, Trans. Am. Electrochem. Soc., 21, 253 (1912).
Wen, C. Y. et al, "The Effect of Organic and Inorganic `Addition Agents` Upon the Electrodeposition of Copper From Electrolytes Containing Arsenic," Advance copy from the General Meeting of the American Electrochemical Society, Sep. 21-23, 1911.
Apperson R. Duane
Clouser Sidney J.
Patrick Richard D.
Centanni Michael A.
Gould Inc.
Mayekar Kishor
Niebling John
LandOfFree
Electrodeposited copper foil and process for making same using e does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electrodeposited copper foil and process for making same using e, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrodeposited copper foil and process for making same using e will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2378883