Electrode structure on P-type III group nitride...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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C257S091000, C257S094000, C257S099000, C257S743000, C257S745000, C257S748000, C438S046000, C438S047000, C438S604000, C438S606000

Reexamination Certificate

active

06894391

ABSTRACT:
An electrode structure on a p-type III group nitride semiconductor layer includes first, second and third electrode layers successively stacked on the semiconductor layer. The first electrode layer includes at least one selected from a first metal group of Ti, Hf, Zr, V, Nb, Ta, Cr, W and Sc. The second electrode layer includes at least one selected from a second metal group of Ni, Pd and Co. The third electrode layer includes Au.

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Taek Kim et al., “Cr/Ni/Au ohmic contacts to the moderately doped p- n and n-GaN” Mat. Res. Soc. Symp. Proc. vol. 449, 1997, pp 1061-1065.*
Kim et al., “Cr/Ni/Au ohmic contacts to the moderately doped p- and n-GaN”, Mat. Rss. Soc. Symp. Proc. vol. 449, 1997, pp 1061-1065.*
Trexler et al., “Comparison of Ni/Au, Pd/Au, and Cr/Au metallizations for ohmic contacts to p-GaN”, Mat. Rss. Soc. Symp. Proc. vol. 449, 1997, pp 1061-1065.

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