Electrode structure and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S760000, C257S764000, C257S770000, C257S753000, C257S752000, C438S627000, C438S647000, C438S628000, C438S644000

Reexamination Certificate

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06879043

ABSTRACT:
The electrode structure of this invention includes a silicon-containing film containing silicon as a principal constituent; a barrier metal layer of titanium nitride rich in titanium as compared with a stoichiometric ratio formed on the silicon-containing film; and a metal film with a high melting point formed on the barrier metal layer.

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