Electrode reshaping in a semiconductor etching device

Details Electrode reshaping in a semiconductor etching device Electrode reshaping in a semiconductor etching device

1996-10-08

1999-05-18

Breneman, Bruce

Semiconductor device manufacturing: process

With measuring or testing

438719, 438729, 156345, 118723E, G01N19/08

Patent

active

059044870

ABSTRACT:
An electrode reshaping process and apparatus is provided for use in a semiconductor etching device. A wafer is place between upper and lower electrodes of the semiconductor etching device. The apparatus and method selectively adjusts the shape of an upper electrode in the semiconductor etching device to compensate for non-uniformities inherent in the etching device. One or more motors attached to the upper electrode provide the electrode shaping forces in accordance with information provided by etch rate variation models stored in a host computer. With the shape of the upper electrode adjusted, the wafer can be etched more uniformally.

REFERENCES:
patent: 4340462 (1982-07-01), Koch
patent: 4908095 (1990-03-01), Kagatsumi et al.
patent: 5248371 (1993-09-01), Maher et al.

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