Electrode pattern and wire bonding method

Details Electrode pattern and wire bonding method Electrode pattern and wire bonding method

2008-03-05

2009-06-23

Nguyen, Chau N (Department: 2831)

Electricity: conductors and insulators

Conduits, cables or conductors

Combined

C257S738000

Reexamination Certificate

active

07550673

ABSTRACT:
An electrode pattern for wire-bonding includes: a wire-bonding reference pattern indicating a reference position for determination of a wire-bonding position; and a wire-bonding recognition pattern. The distance between the reference position and a wire-bonding metal portion bonded to the electrode pattern and the distance between the wire-bonding recognition pattern and the wire-bonding metal portion satisfy predetermined relationships.

REFERENCES:
patent: 6144102 (2000-11-01), Amagai
patent: 2005/0151251 (2005-07-01), Adachi et al.
patent: 2001-326241 (2001-11-01), None

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