Electrode on heat-resisting and isolating substrate and the manu

Details Electrode on heat-resisting and isolating substrate and the manu Electrode on heat-resisting and isolating substrate and the manu

1983-06-30

1985-04-09

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 92, 427 98, 427305, 427306, C23C 302

Patent

active

045101795

ABSTRACT:
This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % and the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

REFERENCES:
patent: 3322881 (1967-05-01), Schneble
patent: 4011087 (1977-03-01), Short
patent: 4150995 (1979-04-01), Moritsu
patent: 4196029 (1980-04-01), Privas
patent: 4340618 (1982-07-01), Fury

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