Electrode on heat-resisting and isolating substrate

Details Electrode on heat-resisting and isolating substrate Electrode on heat-resisting and isolating substrate

1985-02-01

1985-12-17

O'Keefe, Veronica

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428652, 428668, 428669, 428671, 428673, C23C 300, C23C 302

Patent

active

045592799

ABSTRACT:
This invention provides an electrode on a heat-resisting and isolating substrate which is low-priced and has a stable character and the manufacturing process therefor. A paste which comprises 0.05 to 40 weight % of a metal material containing silver component of 0.5 to 100 weight % the remaining weight % of an organic vehicle, is formed on the substrate, and is heated at temperatures of 250.degree. to 900.degree. C. and consequently a metallic particle layer of 0.05 to 2 microns in thickness is formed on the substrate, and then an electrode of nickel and copper of 0.1 to 20 microns in thickness is built up on it by electroless plating.

REFERENCES:
patent: 3322881 (1967-05-01), Schneble
patent: 3382067 (1968-05-01), Sandstede et al.
patent: 3947333 (1976-03-01), Bianchi et al.
patent: 3992279 (1976-11-01), Larsson
patent: 4011087 (1977-03-01), Short
patent: 4150995 (1979-04-01), Moritsu
patent: 4196029 (1980-04-01), Privas
patent: 4340618 (1982-07-01), Fury
patent: 4416916 (1983-11-01), Aykau et al.

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