Electrode, method for producing same and semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S768000, C257SE23159, C257SE21161, C438S656000, C438S660000

Reexamination Certificate

active

10574933

ABSTRACT:
There is provided a technology for obtaining an electrode having a low contact resistance and less surface roughness. There is provided an electrode comprising a semiconductor film101, and a first metal layer102and a second metal layer103sequentially stacked in this order on the semiconductor film101, characterized in that the first metal film102is formed of Al, and the second metal film103is formed of at least one metal selected from the group consisting of Nb, W, Fe, Hf, Re, Ta and Zr.

REFERENCES:
patent: 5563422 (1996-10-01), Nakamura et al.
patent: 5652434 (1997-07-01), Nakamura et al.
patent: 5767581 (1998-06-01), Nakamura et al.
patent: 5770489 (1998-06-01), Onda
patent: 5877558 (1999-03-01), Nakamura et al.
patent: 6011281 (2000-01-01), Nunokawa et al.
patent: 6093965 (2000-07-01), Nakamura et al.
patent: 6146931 (2000-11-01), Nunokawa et al.
patent: 6204512 (2001-03-01), Nakamura et al.
patent: 6507041 (2003-01-01), Nakamura et al.
patent: 6610995 (2003-08-01), Nakamura et al.
patent: 6998690 (2006-02-01), Nakamura et al.
patent: 7078733 (2006-07-01), Sotani et al.
patent: 2004/0026701 (2004-02-01), Murai et al.
patent: 07-045867 (1995-02-01), None
patent: 07-248204 (1995-09-01), None
patent: 09-219539 (1997-08-01), None
patent: 10-022494 (1998-01-01), None
patent: 11-162996 (1999-06-01), None
patent: 11-220168 (1999-08-01), None
patent: 11-330558 (1999-11-01), None
patent: 2000-164928 (2000-06-01), None
patent: 2001-148533 (2001-05-01), None
patent: 2001-196574 (2001-07-01), None
patent: 2002-319593 (2002-10-01), None
patent: 2003-077862 (2003-03-01), None
Ghandhi, S.K., VLSI Fabrication Principles, John Wiley & Sons, 1983, p. 437.
Kumar et al., “Thermally-Stable Low-Resistance Ti/Al/Mo/Au Multilayer Ohmic Contacts onn-CaN,” Journal of Applied Physics, vol. 92, No. 3, Aug. 1, 2002, pp. 1712-1714.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Electrode, method for producing same and semiconductor... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrode, method for producing same and semiconductor..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrode, method for producing same and semiconductor... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3920388

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.