Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate
2011-07-26
2011-07-26
Le, Thanh-Tam T (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
C349S150000
Reexamination Certificate
active
07985078
ABSTRACT:
The electrode junction structure includes: a glass substrate; a plurality of flexible substrates, in a planar view, arranged to cross over an edge of the glass substrate and arranged to have a space from each other along the edge; an adhesive for joining the glass substrate and each flexible substrate; and a sealing resin for covering junction portions between the glass substrate and each flexible substrate, wherein an edge of the sealing resin is formed so that the edge of the sealing resin has, in the planar view, a consecutive waveform portion in which a convex portion and a concave portion alternate with an imaginary line as a center axis, the imaginary line being parallel to the edge of the glass substrate and locating outer than the edge of the glass substrate, and wherein the convex portions are formed to be located on the flexible substrates.
REFERENCES:
patent: 5317438 (1994-05-01), Suzuki et al.
patent: 6086441 (2000-07-01), Akiguchi et al.
patent: 6952250 (2005-10-01), Ueda
patent: 11-016502 (1999-01-01), None
Kumazawa Kentaro
Ono Masahiro
Tomura Yoshihiro
Le Thanh-Tam T
Panasonic Corporation
Wenderoth , Lind & Ponack, L.L.P.
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