Electrode interface for high-dielectric-constant materials

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor

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3613214, 361305, 257295, H01G 410

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active

057814040

ABSTRACT:
A preferred embodiment of this invention comprises a first thin dielectric buffer layer of a first leakage-current-density material (e.g. strontium titanate 32) with a first moderate-dielectric-constant, a high-dielectric-constant layer of a second leakage-current-density material (e.g. barium strontium titanate 34) overlaying the first thin dielectric buffer layer, and a second thin dielectric buffer layer of a third leakage-current-density material (e.g. strontium titanate 36) with a second moderate-dielectric-constant overlaying the high-dielectric-constant layer, wherein the first and third leakage-current-density materials have substantially lower leakage-current-densities than the second leakage-current-density material. The first and second thin moderate-dielectric-constant buffer layers (e.g. strontium titanate 32, 36) substantially limit the leakage-current-density of the structure, with only modest degradation of the dielectric constant of the structure. The possibly lower dielectric constant of the structure is generally compensated for by the reduced leakage current of the structure. The additional layers generally require only minor modifications of existing processes, since the same processes that are used for the high-dielectric-constant oxide can generally be used for the low leakage-current-density dielectric. These structures may also be used for multilayer capacitors and other thin-film ferroelectric devices such as pyroelectric materials, non-volatile memories, thin-film piezoelectric and thin-film electro-optic oxides.

REFERENCES:
patent: 5003428 (1991-03-01), Shepherd
patent: 5053917 (1991-10-01), Miyasaka et al.
patent: 5142437 (1992-08-01), Kammerdiner et al.
patent: 5218512 (1993-06-01), Nakamura
patent: 5262920 (1993-11-01), Sakuma et al.
patent: 5338951 (1994-08-01), Argos, Jr. et al.
Ciaran J. Brennan, Characterization and Modelling of Thin-Film Ferroelectric Capacitors Using C-V Analysis, pp. 354-363 (No date provided.
David R. Lide, Ph.D., CRC Handbook of Chemistry and Physics, 74th Edition 1993-94, pp. 37, 44-45.
Scott, Melnic,, Araujo, McMillan & Zuleeg, D. C. Leakage Currents in Ferroelectric Memories, pp. 176-184 (No date provided).
Miyaska & Matsubara, Dielectric Properties of Sputter-Deposited DaTiO.sub.3 Thin Films, pp. 121-124 (No date provided).
Bernstein, Wong, Kisler & Tustison, Fatigue of ferroelectric PbZr.sub.x Ti.sub.y O.sub.3 capacitors with RU and RuO.sub.x electrodes., Jan. '93, pp. 12-13.
Tasch, Jr., and Parker, Memory Cell and Technology Issues for 64-and 256-Mbit One-Transistor Cell MOS DRAMs, Mar. 1989, pp. 374-388.
Yamamichi, Sakuma, Takemura and Miyasaka, SrTi0.sub.3 Thin Film Preparation by Ion Beam Sputtering and Its Dielectric Properties, Jul. 1991, pp. 2193-2196.
Koyama, Sakum, Yamamichi, A Stacked Capacitor With (Ba.sub.x Sr.sub.1-x)TiO.sub.3 For 256M Dram, 1991, pp. 32.1.1.-32.1.4.
Parikh, Stephen, Swanson & Myers, Study of diffusion Barriers for PZT Deposited On Si For Non-Volatile Random-Access Memory Technology, 1990, pp. 193-199.
Waser and Klee, Theory of Conduction and Brekdown in Perovskite Thin Films, pp. 288-305 (No date provided).

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