Electrode forming system for chip components

Details Electrode forming system for chip components Electrode forming system for chip components

1993-12-06

1996-08-20

Lamb, Brenda A.

Coating apparatus

Immersion or work-confined pool type

With means for moving work through, into or out of pool

118500, 414935, 414940, B05C 300

Patent

active

055475116

ABSTRACT:
An electrode forming system automatically carries out overall steps of charging chip components, coating electrode material on both ends of the components and discharging the components using a holding plate, a guide plate and a spacer. This system comprises a charger, a transferer, an electrode coater, a drying furnace, a holding plate standby means, a spacer storage means, a holding plate storage means, a discharger, a transport robot, conveyor means and a control unit. Movements of these apparatus are integratedly controlled by the control unit. The robot transports the holding plate, the guide plate or the spacer among these apparatus arranged within its working area.

REFERENCES:
patent: 4141458 (1979-02-01), Brooks et al.
patent: 4395184 (1983-07-01), Braden
patent: 4664943 (1987-03-01), Nitta et al.
patent: 4669416 (1987-06-01), Delgado et al.
patent: 4788931 (1988-12-01), Nitta et al.
patent: 4808059 (1989-02-01), Eddy
patent: 4847991 (1989-07-01), Higuchi
patent: 4859498 (1989-08-01), Yamaguchi
patent: 4903393 (1990-02-01), Higuchi
patent: 4926789 (1990-05-01), Wenger et al.
patent: 5167326 (1992-12-01), Murphy
patent: 5248340 (1993-09-01), Nakagawa et al.
patent: 5339537 (1994-08-01), Kuster

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