Electrode forming method

Details Electrode forming method Electrode forming method

2007-11-06

2007-11-06

Olsen, Allan (Department: 1763)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S054000, C257SE21172

Reexamination Certificate

active

10934379

ABSTRACT:
An electrode forming method with an excellent yield, includes: (a) forming an adhesion preventing member having a predetermined pattern on a base member: (b) forming a conductive layer on the base member and the adhesion preventing member; and (c) forming an electrode having a predetermined pattern by removing the conductive layer on the adhesion preventing member in a state in which the adhesion preventing member is disposed on the base member. Adhesion between the adhesion preventing member and the conductive layer is smaller than adhesion between the base member and the conductive layer.

REFERENCES:
patent: 2837619 (1958-06-01), Stein
patent: 4526810 (1985-07-01), Nesbitt
patent: 4775611 (1988-10-01), Sullivan
patent: 5325583 (1994-07-01), Shimizu et al.
patent: 5950305 (1999-09-01), Roberts
patent: 6264851 (2001-07-01), Markovich et al.
patent: 6900069 (2005-05-01), Kaneko et al.
patent: 6966997 (2005-11-01), Inganas et al.
patent: 7151209 (2006-12-01), Empedocles et al.
patent: 2004/0043334 (2004-03-01), Kobayashi et al.
patent: 2005/0133575 (2005-06-01), Gayden et al.
patent: A-54-2941 (1979-01-01), None
patent: A-3-40429 (1991-02-01), None
patent: A-03-248527 (1991-11-01), None
patent: A-5-343795 (1993-12-01), None
patent: A-07-066153 (1995-03-01), None
patent: A 2000-58481 (2000-02-01), None
patent: A-2000-223443 (2000-08-01), None
patent: A-2002-335044 (2002-11-01), None

Affiliated with

Also associated with

Rating

Electrode forming method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electrode forming method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrode forming method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3832254