Electrode forming apparatus for chip type electronic components

Details Electrode forming apparatus for chip type electronic components Electrode forming apparatus for chip type electronic components

1992-02-25

1997-05-27

Lamb, Brenda A.

Coating apparatus

With heat exchange, drying, or non-coating gas or vapor...

118 66, B05C 1300

Patent

active

056328133

ABSTRACT:
A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360.degree. for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.

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