Etching a substrate: processes – Forming or treating electrical conductor article
Patent
1997-09-30
2000-05-30
Bueker, Richard
Etching a substrate: processes
Forming or treating electrical conductor article
216 24, 216 41, 216 51, 438 31, H01L 2100, H01L 2128
Patent
active
060687819
ABSTRACT:
A metal film consisting of a first metal layer of at least one of Ta, Cr, W and Mo, a second metal layer of at least one of Au, Pt and Ag and a third metal layer of at least one of Ta, Cr, W and Mo superposed one on another in this order is formed on a surface of a substrate. Openings of predetermined shapes are formed in the metal film, and proton exchange is carried out on the surface of the substrate with the metal film used as a mask, thereby forming optical channel waveguides. Then the third metal layer is removed from the metal film, and the metal film consisting of the first and second metal layers into electrodes for applying an electric voltage to the optical channel waveguides.
REFERENCES:
patent: 5182228 (1993-01-01), Sekii et al.
patent: 5205904 (1993-04-01), Yamamoto et al.
patent: 5734772 (1998-03-01), Gopalan et al.
Bueker Richard
Fuji Photo Film Co. , Ltd.
Powell Alva C
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